Laser Direct Imaging

TZTEK TZDI series laser direct imaging device uses submicron linear module, fully-enclosed optical design and all new generation DMD control technique to provide highly resolved, highly productive and highly accurate features as compared with traditional PCB touch imaging。 It is applicable to image transfer of double-sided board, multi-layer board and HDI board in the rigid board field, as well as FPC and IC carrier boards。

SPECIFICATION PARAMETER

Specifications


TZDI-55 TZDI-35 TZDI-25 TZDI-18
Applicable fields Traditional multi-layer boards FPC、HDI High order FPC, IC boards COF, high order IC carrier boards
Applicable process Internal & external lines
Capacity(s/side) Single table 12* 13.5** 20** 21.5***
Double tables 9.5* 10.5** 15.5** 17.5***
Max. size(mm) 630×810 550×810 550×670 520×670
Min. size(mm) 125×125
Board thickness range(mm) 0.025-5
Extreme resolution(μm)**** 35/35 15/15 12/12 10/10
Volume production resolution(μm) 55/55 35/35 25/25 18/18
Aligning precision(μm) ±12 ±8 ±6 ±5
Interlayer aligning precision(μm) 24 16 12 10
Light source wave length(nm) 405
Energy uniformity 95%
Depth of field(μm) ±300 ±150 ±100 ±75
Ambient temperature 22±2℃
Ambient RH 55±5%
Cleanness Grade 10,000
Power supply 380VAC,50Hz/60Hz

* Based on a size of 600×500mm, dry film energy not more than 40mj, double outer splicing

** Based on a size of 540×400mm, dry film energy not more than 40mj, double outer splicing

*** Based on a size of 520×400mm, dry film energy not more than 40mj, double outer splicing

**** Use of high resolution dry film, experimental conditions

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